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G.SKILL Announces Double Capacity DDR4 with Trident Z RGB DC Series 32GBx2 Memory Kits

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G.SKILL International Enterprise Co., Ltd., the world’s leading manufacturer of extreme performance memory and gaming peripherals, is excited to announce Trident Z RGB DC series DDR4 64GB (32GBx2) memory kits. Utilizing the latest Double Capacity DIMM technology closely developed with ASUS, the Trident Z RGB DC series DDR4 memory is able to provide double the maximum capacity of DDR4 UDIMM modules on select ASUS Z390 chipset motherboards.

Double Capacity DIMM Technology

Up until now, 16 DRAM ICs per module was the maximum quantity of memory chips on standard UDIMM memory solutions. For this major technological limitation breakthrough, G.SKILL worked together with the ASUS ROG team to develop a brand new customized PCB solution that doubles per module capacity to 32 DRAM ICs. This increases memory density up to 32GB per module with current 8Gb DRAM components. The Trident Z RGB DC memory modules stand taller than the classic Trident Z RGB modules in order to accommodate the increased number of DRAM chips, while maintaining the award-winning Trident Z design and the customizable RGB functionality through the same lighting control software, as well as the ASUS Aura Sync software.

Trident Z RGB DC_03

Supported Only by Select ASUS Z390 Motherboards

In cooperative development with ASUS, the Double Capacity UDIMM technology in the Trident Z RGB DC series memory kits is only supported on the three latest ASUS Z390 chipset motherboards at launch: ROG Z390 MAXIMUS XI APEX, ROG Maximus XI Gene, and ROG STRIX Z390-I GAMING. Previously, motherboards designed with only 2 memory slots only allow a maximum of 32GB (16GBx2) to be installed, but with the new DC technology, it’s now possible to install the maximum supported capacity of 64GB on these 2-DIMM motherboards.

Trident Z RGB DC_04

High Speed Specifications

Engineered by the experienced G.SKILL R&D team, the Trident Z RGB DC series at launch is meticulously designed with powerful Samsung B-die ICs to deliver ultra-fast overclocking speeds up to DDR4-3200MHz at CL14 timings, even with 64GB large capacity kits. Supporting Intel XMP 2.0 profiles for a trouble-free overclocking experience, the following chart shows the available specifications at launch:

 

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